接插件镀金、镀银层变色原因及防变色措施

分别探讨了接插件镀金和镀银层变色的原因.镀金层的变色原因如下：基体质量不符合要求,产品的设计及电镀工艺存在缺陷（包括产品前处理工艺、金阻挡层镀液体系的选择、镀液的维护、电镀工艺参数的选择和电镀方式等的不妥当）,镀后处理不力,产品使用环境的差异等.镀银层变色的原因如下：基体形状复杂且其表面粗糙度高,电镀工艺不完善,包装方式不当,产品使用环境差异等.提出了镀层的防变色措施：提高基体质量,减少设计缺陷,改进电镀工艺,加强镀后工序管理,根据产品的使用环境对其制定不同的质量要求等。

Tarnishing causes and tarnishing resistant measures of gold and silver-plated connectors

The causes of tarnishing gold and silver-plated connectors were studied respectively. The causes of tarnishing gold electrodeposit were as follows: the substrate quality is not up to the standard. Defects exist in design of product and electroplating process (including product pretreatment, the option of bath system for gold barrier, bath maintenance , option of electroplating process parameter and ways of electroplating, etc.). Post-treatments were inadequate and difference of product application environments, etc. Causes of silver electrodeposit tarnishing were as follows: complicated shape of substrates and high roughness of surface, incomplete electroplating process, unsuitable way of packing and difference of product application environments, etc. The preventive measures against tarnishing include improvement of substrate quality, decreasing defect of design, improving electroplating process, strengthening the management of post-treatment and instituting different quality requests according to the product applied in various environments, etc.