| 无铅化焊接对印制电路板的影响 |
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| 引用本文： | 胡志勇. 无铅化焊接对印制电路板的影响[J]. 计算机工程, 2008, 34(Z1) |
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| 作者姓名： | 胡志勇 |
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| 作者单位： | 华东计算技术研究所,上海,201233 |
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| 摘 要： | 人们在寻找无铅化焊料时很容易忽略来自于无铅化制造所涉及到的广泛的关联领域.该文描述了无铅化焊接对印制电路板的影响,使用无铅化焊接要求对印刷电路板材料的选择进行了重新的审视.
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| 关 键 词： | 无铅化焊接 印制电路板 电子组装 |
Effect of Lead-free Solders to Printed Circuit Boards |
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| HU Zhi-yong. Effect of Lead-free Solders to Printed Circuit Boards[J]. Computer Engineering, 2008, 34(Z1) |
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| Authors: | HU Zhi-yong |
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| Affiliation: | HU Zhi-yong (East China Institute of Computer Technology,Shanghai 200233) |
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| Abstract: | Its easy to get distracted from the broader implications of lead-free manufacturing when lead-free solders are searched.This paper presents the effect of lead-free solders to printed circuit boards,using lead-free solder requires a reexamination of PCB material choices. |
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| Keywords: | lead-free solders printed circuit boards electronic packaging |
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