PZT thin film preparation by pulsed DC magnetron sputtering |
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Authors: | Y.C. Lin H.A. Chuang J.H. Shen |
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Affiliation: | Department of Mechatronics Engineering, National Changhua University of Education, Changhua 50007, Taiwan |
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Abstract: | Pulsed DC magnetron sputtering was used in this study to prepare lead zirconate titanate (Pb(ZrxTi1−x)O3, PZT) thin films. A single metallic target was used for the deposition onto a Pt/Ti/SiO2/Si substrate and parameters such as: pulse frequency, duty cycle, O2/Ar flow ratio controlled so as to analyze the effect of the parameters on thin film deposition rate, crystalline structure and morphology. After the deposition, the thin film was annealed in a rapid thermal annealing (RTA) furnace. The experimental results showed that, when the pulse frequency was in the range of 10 kHz-100 kHz, along with the lowering of frequency and the oxygen argon flow rate ratio, the deposition rate gradually increased and the formation of PZT thin film perovskite phase was enhanced; however, if the oxygen argon flow rate ratio was too high, it caused the PZT thin film to generate a pyrochlore phase. However, when the duty cycle was in the range of 95%-75%, the highest deposition rate and better perovskite phase could be obtained in the range of 75%-80%. |
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Keywords: | PZT thin film Pulsed DC magnetron sputtering Metallic target Deposition rate |
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