扫描喷射电沉积纳米晶铜的试验研究

对扫描喷射电沉积纳米晶铜的工艺特点和沉积层微观结构进行了研究。结果表明，扫描喷射电沉积的电流密度和沉积速度随电压的增大呈线性增大，可用电流密度和沉积速度远高于传统电沉积。电流密度、喷射流量和扫描速度都对沉积层的表面生长形态有较大的影响，使用低电流密度、高喷射流量和快扫描速度有利于获得平整、致密的沉积层，在较大的电流密度范围内可获得晶粒尺寸小于40nm的铜沉积层。电流密度由100A／dm^2增至300A／dm^2时，择优取向晶面由(220)晶面逐渐转变为(111)晶面。

Experimental Investigation of Nanocrystalline Copper Prepared by Scanning Jet Electrodepositing

The processing character and microstructure of nanocrystalline copper getting by scanning jet depositing were investigated. The results show that current density and electrodepositing speed increase with the increase of electrodepositing voltage, and they are very higher than that used in traditional electrodepositing. Current density, electrodepositing speed and scanning jet speed have great effects on the surface morphology of copper deposition .Level and dense copper deposition can be got by lower current density, high jet flow and rapid scanning speed. The size of nanocrystalline copper within 40nm can be prepared in a large range of current density. Prior growing facet changes from (220) to (111) facet when current density increases from 100A/dm 2 to 300A/dm 2.