| 微电子封装外壳电镀前处理述评 |
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| 引用本文： | 张志谦,刘圣迁. 微电子封装外壳电镀前处理述评[J]. 电镀与精饰, 2009, 31(9) |
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| 作者姓名： | 张志谦 刘圣迁 |
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| 作者单位： | 河北半导体研究所,河北,石家庄,050051 |
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| 摘 要： | 讨论了微电子封装外壳电镀前处理不良引起的镀层质量问题,特别对封装外壳污染物的种类以及污染程度的影响提出了相应的前处理措施.为了弥补常规前处理方法的不足、对目前普遍使用的非常规处理方法及其应用情况作了简要的评述.
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| 关 键 词： | 微电子封装外壳 镀前处理 非常规处理 镀层质量 |
A Review of Pretreatment of Microelectronics Packages for Electroplating |
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| ZHANG Zhi-qian,LIU Sheng-qian. A Review of Pretreatment of Microelectronics Packages for Electroplating[J]. Plating & Finishing, 2009, 31(9) |
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| Authors: | ZHANG Zhi-qian LIU Sheng-qian |
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| Affiliation: | ZHANG Zhi-qian,LIU Sheng-qian(Hebei Semiconductor Research Institute,Shijiazhuang 050051,China) |
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| Abstract: | The coating quality problems,which were caused by improper pretreatment for electroplating of the microelectronics packages,are discussed in the paper.The impact of the pollutant categories and the pollution extent on the pretreatment are discussed and the countermeasure for this is proposed.In order to improve the coating quality by using the conventional pretreatment methods,some unconventional treatment methods as well as their applications are briefly reviewed. |
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| Keywords: | microelectronics package pretreatment unconventional treatment method coating quality |
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