| Abstract: | The IR‐spectroscopy and MVCIR technique were used to study the role of technological factors (filler content, film thickness) in oxidation of polyethylene coatings filled with copper powder. It was learned that copper powder introduced into polyethylene reduces the ultimate level of oxidation of both the outer surface layer and deep‐seated layers of the polymer; also, the layer thickness of the specimens oxidized at diffusion conditions was observed to be decreased. Besides, the oxidation gradient determined through the specimen thickness was decreased on increasing the filler content. For example, with copper concentration over 3 vol %, the ultimate level of oxidation within the polymer layer that undergoes diffusive oxidation remains unchanged. The filler exerts its influence on bonding of the coatings, first of all through variations in the oxidation level of the polymer layer bordering on the substrate. For example, at the filler concentration above 3 vol %, the achievable level of adhesional strength does not depend on the coat thickness (the coat thickness being smaller than that of the diffusively oxidized layer). In thicker coatings, oxidative transformations do not, in fact, take place in the zone of adhesional contact, and the adhesion strength remains unchanged during thermal treatment. © 2001 John Wiley & Sons, Inc. J Appl Polym Sci 80: 2047–2052, 2001 |
