|
|||||
|
|
Wafer-level vacuum package of two-dimensional micro-scanner |
|
| Authors: | Chu Hoang Manh Sasaki Takashi Hane Kazuhiro |
| Affiliation: | 1.Department of Nanomechanics, Tohoku University, Sendai, 980-8579, Japan ;2.International Training Institute for Materials Science, Hanoi University of Science and Technology, Hanoi, Vietnam ; |
| Abstract: | Microsystem Technologies - We present wafer-level vacuum package of two-dimensional (2-D) micro-scanner based on glass-silicon anodic bonding. To form the sacrificial gap for evacuating air in the... |
| Keywords: | |
| 本文献已被 SpringerLink 等数据库收录！ | |