| 用正交试验法优化挠性多层板层压工艺参数 |
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| 引用本文： | 何为,李浪涛,何波,乔三龙. 用正交试验法优化挠性多层板层压工艺参数[J]. 印制电路信息, 2005, 0(6): 53-54 |
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| 作者姓名： | 何为 李浪涛 何波 乔三龙 |
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| 作者单位： | 1. 电子科技大学化学系,610054
2. 珠海元盛电子科技有限公司,519106 |
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| 摘 要： | 利用正交实验法对挠性多层线路板的层压参数进行了优化,对层压之后的层间重合度也提出了相应的校正方法。
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| 关 键 词： | 挠性线路板 层压 剥离强度 |
Optimum of Technology Parameters about Lamination of Flexible Multilayer Printed Board with Orthogonal Experiment |
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| He Wei,Li Langtao,He Bo,Qiao Sanlong. Optimum of Technology Parameters about Lamination of Flexible Multilayer Printed Board with Orthogonal Experiment[J]. Printed Circuit Information, 2005, 0(6): 53-54 |
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| Authors: | He Wei Li Langtao He Bo Qiao Sanlong |
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| Affiliation: | He Wei Li Langtao He Bo Qiao Sanlong |
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| Abstract: | The optimum of technology parameters about lamination in FPC manufacture was obtained throughorthogonal experiment.Correction method about the layer-to-layer registration and peel strength after lamination wasalso discussed. |
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| Keywords: | FPC lamination peel strength |
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