| SoC设计中虚部件构建与封装方法研究 |
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| 引用本文： | 夏新军,文宏,陈吉华. SoC设计中虚部件构建与封装方法研究[J]. 计算机应用与软件, 2005, 22(6): 6-8 |
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| 作者姓名： | 夏新军 文宏 陈吉华 |
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| 作者单位： | 湖南科技大学计算机学院,湖南,湘潭,411201;国防科技大学计算机学院,湖南,长沙,410073 |
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| 基金项目： | 863国家高技术研究发展计划(编号:2002AA1Z1480) |
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| 摘 要： | 近年来,软硬件协同设计技术受到了系统级设计语言和基于平台设计方法的深刻影响。本文提出了一种基于层次平台的SoC系统设计方法,将SoC系统设计过程分为系统层、虚部件层和实部件层三个设计层次。分析了在虚部件层中设计虚部件时必须满足的三个方面的需求,提出了一种新的虚部件构建和封装方法。
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| 关 键 词： | 系统芯片 基于平台的设计 基于层次平台的设计 虚部件封装模型 |
| 修稿时间： | 2004-11-01 |
RESEARCH ON THE METHOD OF VIRTUAL COMPONENT CONSTRUCTING AND WRAPPING IN SoC DESIGN |
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| Xia Xinjun,Wen Hong,Chen Jihua. RESEARCH ON THE METHOD OF VIRTUAL COMPONENT CONSTRUCTING AND WRAPPING IN SoC DESIGN[J]. Computer Applications and Software, 2005, 22(6): 6-8 |
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| Authors: | Xia Xinjun Wen Hong Chen Jihua |
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| Affiliation: | Xia Xinjun 1 Wen Hong 1 Chen Jihua 2 1 |
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| Abstract: | Hardware/Software Co-design has been deeply affected with the development of system level languages and platform-based design methodology.This paper puts forward a novel SoC design methodology based on hierarchical platform,in which we divide the SoC design procedure into system level,virtual component level,and real component level.This paper also analyses the demands of constructing a virtual component in three aspects,and puts forward a novel method to construct and wrap a virtual component. |
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| Keywords: | SoC Platform-based design Hierarchical platform-based design The model of virtual component wrapping |
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