高密度封装电子设备先进热管理技术发展现状

随着基础器件材料、加工工艺以及系统集成的巨大进步,军用电子系统尺寸越来越小,功率越来越大,导致热密度不断攀升,对冷却技术的要求越来越高.为提高军事电子系统的性能和可靠性,减小其体积、重量和功耗,美国国防预先研究计划局(DARPA)积极将微电子、纳米、微流体等先进技术应用在军事电子装备的热控中,试图打破制约装备发展的热瓶颈.文中分芯片、模块和设备3个层级概述了热管理技术途径,阐述了DARPA热管理计划及其包含的具体项目,根据最新开展的芯片内/芯片间增强冷却(ICECool)项目,指出了热控技术的发展方向.

Development Status of Advanced Thermal Management Technology for High-density Packaged Electronic Equipment

With tremendous progress in the field of fundamental material, processing technology and system integration capability, the military electronic system becomes smaller and smaller and higher and higher in power, which leads to rising thermal flux and critical cooling requirement. DARPA has been actively applying microelectronics, nanotechnology microfluidics and other advanced technologies to thermal control of military electronic equipment so as to improve the system performance and reliability, reduce the size, weight and power of the military electronic system and finally break thermal bottleneck restraining equipment development. In this paper, approaches for thermal management are described from chip, module and equipment. The thermal management program and projects of DARPA are introduced. And the development trend of thermal management technologies is pointed out according to the newly developed ICECool project.