| 新型基片材料——C/SiC复合材料 |
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| 引用本文： | 杨会永,刘荣军,周新贵,曹英斌.新型基片材料——C/SiC复合材料[J].材料导报,2012,26(1):20-23. |
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| 作者姓名： | 杨会永 刘荣军 周新贵 曹英斌 |
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| 作者单位： | 国防科技大学新型陶瓷纤维及复合材料重点实验室,长沙,410073 |
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| 摘 要： | 阐述了目前常用的3大类基片材料,即塑料基、金属基和陶瓷基材料,比较了3类材料的性能,得出了陶瓷基材料是综合性能较好的基片材料的结论,并比较了目前陶瓷基片材料中的Al2O3、AlN、BeO、SiC的性能,认为SiC作为基片材料具有良好的发展前景;针对单相SiC陶瓷固有脆性导致难以大尺寸成型的问题,提出了使用C/SiC复合材料制备基片材料的可能性,并综述了C/SiC复合材料的制备工艺,比较了3种工艺(PIP、CVI、LSI)所制备的材料的性能,认为液相渗硅(LSI)C/SiC复合材料制备大尺寸封装基片材料是未来最具前景的发展方向。
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| 关 键 词： | 基片材料 C/SiC复合材料 电子封装 |
New Board Material-C/SiC Composite |
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| YANG Huiyong
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LIU Rongjun
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ZHOU Xingui
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CAO Yingbin.New Board Material-C/SiC Composite[J].Materials Review,2012,26(1):20-23. |
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| Authors: | YANG Huiyong LIU Rongjun ZHOU Xingui CAO Yingbin |
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| Affiliation: | (Key Laboratory of Novel Ceramic Fibers & Composite Materials,National University of Defense Technology,Changsha 410073) |
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| Abstract: | Three kinds of common board materials(plastic,metal and ceramics) are stated and their properties are compared.Ceramics is thought to have well comprehensive properties.The properties of Al2O3,AlN,BeO,SiC ceramics board materials are discussed and the SiC ceramics is deemed to have a favorable prospect.Because of the brittleness of monolithic SiC ceramics,C/SiC composites have the possibility to prepare board material of large size.Three kinds of manufacturing process(PIP,CVI,LSI) and their properties of C/SiC composite as-fabricated are mentioned and compared.The liquid silicon infiltration(LSI) is thought to be the most potential candidate to manufacture large size board materials in the future. |
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| Keywords: | board material C/SiC composite electronic packing |
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