首页 | 本学科首页   官方微博 | 高级检索  
     

新颖型弹性膜硅加速度传感器芯片的设计
引用本文:邓永和.新颖型弹性膜硅加速度传感器芯片的设计[J].电子质量,2003(8):49-50.
作者姓名:邓永和
作者单位:湖南工程学院数理系,湖南,湘潭,411100
摘    要:介绍了最新设计的双E型硅传感器芯片的制作工艺。通过控制不同敏感硅芯片弹性膜的厚度,即可制得不同量程的双E型敏感硅芯片和加速度传感器。

关 键 词:厚膜  硅芯片  加速度传感器

Research on design of new Elastomeric film silicon accelerometer chip
DENG Yong-he Dept. of Mathematics and Physics Hunan Institute of Engineering,Xiangtan Hunan,China.Research on design of new Elastomeric film silicon accelerometer chip[J].Electronics Quality,2003(8):49-50.
Authors:DENG Yong-he Dept of Mathematics and Physics Hunan Institute of Engineering  Xiangtan Hunan    China
Affiliation:DENG Yong-he Dept. of Mathematics and Physics Hunan Institute of Engineering,Xiangtan Hunan,411100,China
Abstract:This paper introduces the producing technology of newly designed dual-E silicon sensor chip, which produces dual-E sensitive silicon chip and accelerometer sensor with different scale.
Keywords:thick film silicon chip accelerometer sensor
本文献已被 CNKI 万方数据 等数据库收录!
设为首页 | 免责声明 | 关于勤云 | 加入收藏

Copyright©北京勤云科技发展有限公司  京ICP备09084417号