| 提高大功率LED散热和出光封装材料的研究 |
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| 引用本文： | 殷录桥,李清华,张建华. 提高大功率LED散热和出光封装材料的研究[J]. 半导体技术, 2008, 33(4): 281-285 |
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| 作者姓名： | 殷录桥 李清华 张建华 |
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| 作者单位： | 上海大学机电工程与自动化学院,上海,200072;上海大学新型显示技术及应用集成教育部重点实验室,上海,200072;上海大学上海半导体照明工程技术研究中心封装与可靠性分中心,上海,200072;上海大学机电工程与自动化学院,上海,200072;上海大学新型显示技术及应用集成教育部重点实验室,上海,200072 |
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| 基金项目： | 国家自然科学基金 , 教育部跨世纪优秀人才培养计划 , 上海市科技攻关项目 , 上海市重点学科建设项目 |
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| 摘 要： | 阐述了LED封装材料对大功率LED散热和出先的影响及大功率LED的发展趋势.指出目前大功率LED研究的瓶颈是如何提高散热和出光以及封装互连材料在提高大功率LED散热.和出光方面所具有的重要影响.讨论了芯片粘结材料、荧光粉、灌封胶、散热基板等.分析了导热胶、银浆和合金钎料、陶瓷基板、金属基板、复合基板,讨论了对出光影响比较大的灌封胶和荧光粉的选用,指出了未来的研究重点.
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| 关 键 词： | 大功率LED 芯片粘结 灌封胶 荧光粉 基板 |
| 文章编号： | 1003-353X(2008)04-0281-05 |
| 修稿时间： | 2007-11-14 |
Research on Packaging Materials for Improving LED Heat Dissipation and Light Extraction Efficiency |
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| Yin Luqiao,Li Qinghua,Zhang Jianhua. Research on Packaging Materials for Improving LED Heat Dissipation and Light Extraction Efficiency[J]. Semiconductor Technology, 2008, 33(4): 281-285 |
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| Authors: | Yin Luqiao Li Qinghua Zhang Jianhua |
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| Affiliation: | Yin Luqiaoa,b,c,Li Qinghuaa,Zhang Jianhuaa,c(a.School of Mechanical Engineering , Automation,b.Key Lab.of Advanced Display , System Applications of Ministry of Education,c.Packaging , Reliability Sub-Center of Shanghai Research Center of Engineering , Technology for Semiconductor Lighting,Shanghai University,Shanghai 200072,China) |
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| Abstract: | An overall review of effects of packaging materials on the LED heat dissipation and light extraction was described and the development of new packaging and interconnection materials was reviewed.It is pointed out that the heat dissipation and light extraction are the bottlenecks to the development of the high brightness LED,the packaging and interconnection materials have great influences on the heat dissipation and light extraction efficiency.Die attach materials,phosphor,pouring sealant,heat dissipation s... |
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| Keywords: | high efficiency LED die attaching pouring sealant phosphors substrate |
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