| 电子封装用W／Cu复合材料的特性、制备及研究进展 |
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| 引用本文： | 石乃良 陈文革. 电子封装用W／Cu复合材料的特性、制备及研究进展[J]. 材料导报, 2007, 21(F05): 301-303 |
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| 作者姓名： | 石乃良 陈文革 |
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| 作者单位： | 西安理工大学材料科学与工程学院,西安710048 |
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| 基金项目： | 陕西省自然科学基金资助（2004E105） |
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| 摘 要： | 微电子工业的迅速发展对封装材料的综合性能提出了更为严格的要求。针对封装材料的发展趋势，阐述了以W／Cu作为封装材料所应具备的性能要求及其制备技术，并对其发展方向进行了展望。
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| 关 键 词： | 电子封装 W／Cu合金 研究进展 |
Characteristics , Preparation and Research Advance of W-Cu Composite Material for Electronic Packaging |
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| SHI Nailiang, CHEN Wenge. Characteristics , Preparation and Research Advance of W-Cu Composite Material for Electronic Packaging[J]. Materials Review, 2007, 21(F05): 301-303 |
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| Authors: | SHI Nailiang CHEN Wenge |
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| Abstract: | The development of micro-electronic industry has led to strict claim for the properties of electronic packaging material. According to the new development of packaging material, the demand of characteristics and preparation technology of W/Cu composite material for electronic packaging are expounded in this thesis. And the tendency to develop W/Cu composite material on electronic packaging is reviewed. |
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| Keywords: | electronic packaging W/Cu alloy research advance |
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