A study on robust design optimization of layered plate bonding process considering uncertainties |
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Authors: | J. H. Choi W. H. Lee J. J. Park B. D. Youn |
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Affiliation: | (1) School of Aerospace and Mechanical Engineering, Korea Aerospace University, 200-1 Hwajon-Dong, Dukyang-Ku, Kyunggi-Do, South Korea, 412-791;(2) Department of Mechanical Engineering and Engineering Mechanics Michigan Technological University, Houghton, MI 49931, USA |
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Abstract: | Design optimization of layered plate bonding process is conducted by considering uncertainties in a manufacturing process, to reduce the crack failure arising due to the difference of thermal expansion coefficients of the adherents. Robust optimization is performed to minimize the mean and variance of the residual stress, which is the major cause of the failure, while constraining the distortion and the instantaneous maximum stress to the allowable limits. In this optimization, the dimension reduction (DR) method is employed to quantify the uncertainty of the responses in the bonding process. It is expected that the DR method benefits the optimization from the perspectives of efficiency, accuracy, and simplicity. Response surface method (RSM) combined with sequential approximate optimization (SAO) technique is employed as an optimization tool. The obtained robust optimal solution is verified by the Monte Carlo simulation. |
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Keywords: | Dimension reduction method Reliability analysis Robust optimization Monte Carlo simulation Layered plate bonding |
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