激光抛光技术在红外探测器组件封装中的应用探索

提出将激光抛光技术应用于杜瓦部件激光焊焊缝的抛光处理中，以解决目前红外探测器杜瓦封装激光焊焊缝粗糙度大、探测器组件长时间使用过程中杜瓦焊缝强度和内部真空度欠佳、影响探测器寿命和使用性能的问题。通过实验研究了主要参数对抛光质量的影响规律，并利用激光共聚焦显微镜等设备测试了激光抛光结果。激光抛光技术可使激光焊焊缝的表面粗糙度Ra从0.25mm降低到0.03mm。研究结果充分表明，绿色高效非接触的激光抛光可以实现红外探测器杜瓦组件外表面激光焊焊缝的高质量抛光，在红外探测器制造领域有重大的潜在应用价值。

Application Exploration of Laser Polishing Technology in Package of Infrared Detector Assembly

At present, the roughness of the laser welding line of the dewar package of the infrared detector is large. The strength and internal vacuum of the dewar welding line during the long-term use of the detector components are not good, which affects the life and performance of the detector. In order to solve these problems, it is proposed to apply laser polishing technology to the polishing treatment of laser welding line of dewar components. The experiment investigated the influence of main parameters on the polishing quality, and the laser polishing results were tested using the laser confocal microscope. The results show that the laser polishing technology can reduce the surface roughness Ra of the laser welding line from 0.25 mm to 0.03 mm. This fully proves that the use of green, efficient, non-contact laser polishing can achieve high-quality polishing of the laser welding line of the outer surface of the infrared detector dewar components, which has great potential application value in the field of infrared detector manufacturing.