MEMS硅基环形波动陀螺抗高过载能力测试

针对MEMS硅基陀螺在制导炮弹等高过载环境中的应用,以一种S形弹性梁支撑形式的陀螺结构为研究对象,建立了陀螺结构的冲击动力学方程。利用ANSYS对陀螺结构进行瞬态仿真,仿真结果显示该结构在X、Z方向承受的最大应力分别为232.10 MPa、219.04 MPa,远小于硅材料的极限许用应力(790 MPa)。实验室环境下利用马歇特锤对陀螺结构样品进行高过载试验,冲击幅值为13600 g。试验前后通过共聚焦显微镜观察陀螺结构表面形貌,结构完好无损;使用拉曼散射光谱系统对非真空封装的陀螺结构进行应力分析,测试点最大应力为276.65 MPa;对真空封装的陀螺结构驱动模态固有频率进行扫频测试,过载前后频率变化量小于0.05%。仿真和试验结果表明该陀螺结构设计合理且抗过载幅值大于10000 g。

High Overload Resistance Test of MEMS Silicon-based Ring Wave Gyroscope

For the application of MEMS silicon-based gyroscopes in high overload environment such as guided projectiles,the impact dynamics equation of a gyroscopic structure supported by an S-shaped elastic beam was established.The transient simulation of gyroscopic structure was carried out with ANSYS,the simulation results show that the maximum stress of the structure in X and Z directions was 232.10 MPa and 219.04 MPa respectively,which was far less than the limit allowable stress of silicon material(790 MPa).In the laboratory environment,Marshall hammer was used to carry out high overload test on gyroscopic structure samples,and the impact amplitude was 13600g.The surface morphology of the gyroscopic structure was observed by confocal microscopy before and after the test,and the structure was intact.The stress analysis of the gyroscopic structure was carried out by Raman scattering spectroscopy system.The maximum stress of the test point was 276.65 MPa.The frequency sweep of the drive mode natural frequency was tested,the frequency variation before and after overload was less than 0.05%.The simulation and experimental results show that the gyroscopic structure is reasonable and the overload resistance is greater than 10000g.