| 多芯片组件基板的热效应分析 |
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| 引用本文： | 张亚平,冯全科,余小玲.多芯片组件基板的热效应分析[J].电力电子技术,2009,43(2). |
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| 作者姓名： | 张亚平 冯全科 余小玲 |
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| 作者单位： | 1. 西安交通大学,陕西,西安,710049;西安科技大学,陕西,西安,710054
2. 西安交通大学,陕西,西安,710049 |
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| 基金项目： | 台达环境与教育基金会《电力电子科技发展计划》资助项目 |
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| 摘 要： | 针对大功率多芯片模块,建立了简化传热模型,利用有限元数值方法,对其热阻和温度场进行了稳态和瞬态分析.模拟结果表明:模块的散热方式以热传导为主.由芯片到外壳底面的热通路为主要散热途径,采用导热性能好的基板是非常有效的散热方案:绝缘层热阻占整个基板热阻的65%;模块设计时要尽量减小功率互连引线的寄生电感和电阻.合理安排功率管芯位置,要求布线尽量短而宽.多个功率芯片要尽量均匀分布于基板上,以此降低结温,避免热集中现象.
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| 关 键 词： | 热效应/多芯片组件 基板 |
Thermal Analysis of Multi Chip Module Substrate |
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| ZHANG Ya-ping,FENG Quan-ke,YU Xiao-ling.Thermal Analysis of Multi Chip Module Substrate[J].Power Electronics,2009,43(2). |
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| Authors: | ZHANG Ya-ping FENG Quan-ke YU Xiao-ling |
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| Affiliation: | ZHANG Ya-ping1,2,FENG Quan-ke1,YU Xiao-ling1 |
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| Abstract: | For the larger power electrical source module,i.e. Multi Chip Module(MCM),a heat transfer model is estab-lished.Three-dimensional finite element model is studied using the finite element method combined with ANSYS program. The analysis of the steady and temporary state temperature field and thermal resistance has been achieved.Simulation re-sults show that the thermal path from chip to the bottom surface of the crust of MCM is the main path for heat dissipation. It is effective to adopt the high conduction ... |
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| Keywords: | thermal effect/multi-chip module substrate |
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