| 基于ANSYS10.0的管道瞬时液相扩散连接有限元数值模拟 |
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| 引用本文： | 王海瑞,李安铭,梁峰.基于ANSYS10.0的管道瞬时液相扩散连接有限元数值模拟[J].热加工工艺,2010,39(1). |
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| 作者姓名： | 王海瑞 李安铭 梁峰 |
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| 作者单位： | 1. 河南理工大学,材料科学与工程学院,河南,焦作,454000;焦作市迈科冶金机械有限公司,河南,焦作,454000
2. 河南理工大学,材料科学与工程学院,河南,焦作,454000 |
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| 摘 要： | 采用有限元分析软件ANSYS10.0对管道瞬时液相扩散连接接头处的残余应力分布进行数值模拟。结果表明,在冷却的初始阶段,焊缝及两侧的母材处的应力急剧下降,残余应力在此产生;冷却后,焊缝处应力下降,且低于两侧母材处的应力;其连接接头的最大应力出现在靠近焊缝两侧的母材上,中间层可以缓和应力的分布。
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| 关 键 词： | 有限元 残余应力 瞬时液相扩散连接 |
Numerical Simulation of Transient Liquid-Phased Bonding Based on ANSYS 10.0 |
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| WANG Haiui,LI Anming,LIANG Feng.Numerical Simulation of Transient Liquid-Phased Bonding Based on ANSYS 10.0[J].Hot Working Technology,2010,39(1). |
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| Authors: | WANG Haiui LI Anming LIANG Feng |
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| Affiliation: | WANG Haiui1,2,LI Anming1,LIANG Feng1(1.College of Material Science , Engineering,Henan Polytechnic University,Jiaozuo 454000,China,2.Jiaozuo Maike Metallurgical Machinery Co.,Ltd.,China) |
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| Abstract: | The numerical simulation of residual stresses in transient liquid-phase bonding(TLP) of pipeline was carried out by ANSYS 10.0.The restults show that,the residual stresses occurs at the initial stage of cooling,because the stresses of weld and near base materials sharply decline;after cooling,the weld stresses drop,and lower than the both sides of the base metal;the maximum stresses of TLP joints in the base metal occurs on both sides of the near weld,intermediate layer can relieve the distribution of stres... |
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| Keywords: | finite element residual stress transient liquid-phase bonding(TLP) |
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