Microstructural evolution of intermetallic compounds in Sn–3.5Ag–X (X = 0, 0.75Ni, 1.0Zn and 1.5In)/Cu solder joints during liquid aging |
| |
| Authors: | Jie Chen Jun Shen Shiqiang Lai Dong Min Xiaochuan Wang |
| |
| Affiliation: | 1. Graduate School of NID Fusion Technology, Seoul National University of Science and Technology, Seoul 139-743, Republic of Korea;2. R&D Center, Flow Master Co., Seoul 150-105, Republic of Korea;3. Department of Mechanical and Automotive Engineering, Seoul National University of Science and Technology, Seoul 139-743, Republic of Korea;1. Advanced Packaging and SMT Unit, School of Mechanical Engineering, Universiti Sains Malaysia, Engineering Campus, 14300 Nibong Tebal, Penang, Malaysia;2. School of Aerospace Engineering, Universiti Sains Malaysia, Engineering Campus, 14300 Nibong Tebal, Penang, Malaysia |
| |
| Abstract: | In this paper, the microstructural evolution of IMCs in Sn–3.5Ag–X (X = 0, 0.75Ni, 1.0Zn, 1.5In)/Cu solder joints and their growth mechanisms during liquid aging were investigated by microstructural observations and phase analysis. The results show that two-phase (Ni3Sn4 and Cu6Sn) IMC layers formed in Sn–3.5Ag–0.75Ni/Cu solder joints during their initial liquid aging stage (in the first 8 min). While after a long period of liquid aging, due to the phase transformation of the IMC layer (from Ni3Sn4 and Cu6Sn phases to a (Cu, Ni)6Sn5 phase), the rate of growth of the IMC layer in Sn–3.5Ag–0.75Ni/Cu solder joints decreased. The two Cu6Sn5 and Cu5Zn8 phases formed in Sn–3.5Ag–1.0Zn/Cu solder joints during the initial liquid aging stage and the rate of growth of the IMC layers is close to that of the IMC layer in Sn–3.5Ag/Cu solder joints. However, the phase transformation of the two phases into a Cu–Zn–Sn phase speeded up the growth of the IMC layer. The addition of In to Sn–3.5Ag solder alloy resulted in Cu6(Snx,In1?x)5 phase which speeded up the growth of the IMC layer in Sn–3.5Ag–1.5In/Cu solder joint. |
| |
| Keywords: | |
| 本文献已被 ScienceDirect 等数据库收录！ |
|
