Investigation of small Sn–3.5Ag–0.5Cu additions on the microstructure and properties of Sn–8Zn–3Bi solder on Au/Ni/Cu pads |
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| Authors: | Asit Kumar Gain Tama Fouzder YC Chan Ahmed Sharif Winco KC Yung |
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| Affiliation: | 1. Department of Electronic Engineering, City University of Hong Kong, Tat Chee Avenue, Kowloon Tong, Hong Kong;2. Electronic and Telecommunication Engineering, Department, University of Development Alternative, Dhaka, Bangladesh;3. Department of Materials and Metallurgical Engineering, Bangladesh University of Engineering and Technology (BUET), Dhaka, Bangladesh;4. Department of Industrial and Systems Engineering, The Hong Kong Polytechnic University, Hung Hom, Kowloon, Hong Kong;1. School of Mechanical Electrical Engineering, Nanchang University, Nanchang 330031, China;2. Institute of Applied Physics, Jiangxi Academy of Sciences, Nanchang 330029, China;3. School of Materials Science and Engineering, Nanchang University, Nanchang 330031, China;4. China Electronics Technology Group Corporation No. 38 Research Institute, Hefei 230088, China;1. Department of Electronic Engineering, City University of Hong Kong, Tat Chee Avenue, Kowloon Tong, Hong Kong;2. School of Materials Science and Engineering, Nanyang Technological University, Singapore 639798, Singapore;3. School of Materials Science and Engineering, Huazhong University of Science and Technology, 1037 Luoyu Road, Wuhan, China;1. Basic Science Department, Higher Technological Institute, 44629 10th of Ramadan City, Egypt;2. Physics Department, Faculty of Science, Suez-Canal University, 41522 Ismailia, Egypt;3. Recruitment Department, University of Hail, Hail 2440, Saudi Arabia;4. Texas State University-San Marcos, Department of Chemistry and Biochemistry, 601 University Dr., San Marcos, TX 78666, USA;1. Department of Mechanical and Manufacturing Engineering, Faculty of Engineering, Universiti Putra Malaysia, 43400 UPM, Serdang, Selangor, Malaysia;2. Research Center Advance Engineering Materials and Composites, (AEMC), Faculty of Engineering, Universiti Putra Malaysia, 43400 UPM, Serdang, Selangor, Malaysia;3. Department of Metallurgy and Materials Science Engineering, Faculty of Engineering, Kirikkale University, Turkey |
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| Abstract: | The formation of intermetallic compounds and the shear strength of Sn–Zn–Bi solder alloys with various (0, 1, 3, 5 and 7 wt%) weight percentages of Sn–Ag–Cu were investigated on Au/Ni metallized Cu pads depending on the number of reflow cycles. In Sn–Zn–Bi solder joints, scallop-shaped AuZn3 intermetallic compound (IMC) particles were found at the interfaces and in the solder ball regions, fine Bi- and needle-shaped Zn-rich phase were observed in the Sn matrix. After Sn–Ag–Cu additions, an additional Ag–Zn intermetallic compound layer was adhered to the top surface of the AuZn3 layer at the interface and fine spherical-shaped AgZn3 intermetallic compound particles were detected in the solder ball regions together with Bi- and Zn-rich phase volumes. After the addition of Sn–Ag–Cu, the shear strength of Sn–Zn–Bi solder joints increased due to the formation of the fine AgZn3 intermetallic compound particles. The shear strengths of Sn–Zn–Bi and Sn–Zn–Bi/7 wt% Sn–Ag–Cu solder joints after one reflow cycle were about 44.5 and 53.1 MPa, respectively and their shear strengths after eight reflow cycles were about 43.4 and 51.6 MPa, respectively. |
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