| Sn3.8Ag0.7Cu和Sn37Pb焊点界面显微结构研究 |
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| 引用本文： | 刘平,姚琲,顾小龙,赵新兵,刘晓刚. Sn3.8Ag0.7Cu和Sn37Pb焊点界面显微结构研究[J]. 电子显微学报, 2011, 30(2): 102-107 |
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| 作者姓名： | 刘平 姚琲 顾小龙 赵新兵 刘晓刚 |
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| 作者单位： | 刘平,LIU Ping(浙江省冶金研究院有限公司浙江省钎焊材料与技术重点实验室,浙江杭州310011;浙江大学材料科学与工程学系,浙江杭州310027);姚琲,YAO Pei(天津大学材料科学与工程学院,天津,300072);顾小龙,刘晓刚,GU Xiao-long,LIU Xiao-gang(浙江省冶金研究院有限公司浙江省钎焊材料与技术重点实验室,浙江杭州,310011);赵新兵,ZHAO Xin-bing(浙江大学材料科学与工程学系,浙江杭州,310027) |
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| 基金项目： | 浙江省自然科学基金资助项目 |
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| 摘 要： | 利用扫描电子显微镜（SEM）和透射电子显微镜（TEM）研究了Sn3.8Ag0.7Cu（Sn37Pb）/Cu焊点在时效过程中的界面金属间化合物（IMC）形貌和成份。结果表明：150℃高温时效50、100、200、500h后,Sn3.8Ag0.7Cu（Sn37Pb）/Cu焊点界面IMC尺寸和厚度增加明显,IMC颗粒间的沟槽越来越小。50h时效后界面出现双层IMC结构,靠近焊料的上层为Cu6Sn5,邻近基板的下层为Cu3Sn。之后利用透射电镜观察了Sn37Pb/Ni和Sn3.8Ag0.7Cu/Ni样品焊点界面,结果显示,焊点界面清晰,IMC晶粒明显。
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| 关 键 词： | Sn3.8Ag0.7Cu Sn37Pb 金属间化合物 扫描电镜（SEM） 透射电镜（TEM） |
Interfacial microstructures of Sn3.8Ag0.7Cu and Sn37Pb joints |
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| LIU Ping,YAO Pei,GU Xiao-long,ZHAO Xin-bing,LIU Xiao-gang. Interfacial microstructures of Sn3.8Ag0.7Cu and Sn37Pb joints[J]. Journal of Chinese Electron Microscopy Society, 2011, 30(2): 102-107 |
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| Authors: | LIU Ping YAO Pei GU Xiao-long ZHAO Xin-bing LIU Xiao-gang |
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| Affiliation: | LIU Ping1,2,YAO Pei3,GU Xiao-long1,ZHAO Xin-bing2,LIU Xiao-gang1(1.Zhejiang Province Key Laboratory of soldering & Brazing Materials and Technology,Zhejiang MetallurgicalResearch Institute,Hangzhou Zhejiang 310011,2.Department of Materials Science and Engineering,Zhejiang University,Hangzhou Zhejiang 310027,3.College of Material Science andEngineering,Tianjin University,Tianjin 300072,China) |
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| Abstract: | The present work studied the IMC morphology and composition at the interface of aged Sn3.8Ag0.7Cu(Sn37Pb)/Cu joints by SEM and TEM.It was found that IMC layer thickness and grain size increased with the increase of aging time.After 50 h aging,Sn3.8Ag0.7Cu(Sn37Pb) /Cu joints exhibited a duplex intermetallic compound structure;i.e.a layer of Cu6 Sn5 close to the solder and a layer of Cu3 Sn adjacent to the Cu substrate.Finally the interface of FIB prepared Sn37Pb/Ni and Sn3.8Ag0.7Cu/Ni sample was examined und... |
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| Keywords: | Sn3.8Ag0.7Cu Sn37Pb |
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