AnIn Situ transmission electron microscope deformation study of the slip transfer mechanisms in metals

The slip transfer mechanisms across grain boundaries in 310 stainless steel, high-purity aluminum, and a Ni-S alloy have been studied by using thein situ transmission electron microscope (TEM) deformation technique. Several interactions between mobile lattice dislocations and grain boundaries have been observed, including the transfer and generation of dislocations at grain boundaries and the nucleation and propagation of a grain boundary crack. Quantitative conditions have been established to correctly predict the slip transfer mechanism. This paper is based on a presentation made in the symposium “Interface Science and Engineering” presented during the 1988 World Materials Congress and the TMS Fall Meeting, Chicago, IL, September 26–29, 1988, under the auspices of the ASM-MSD Surfaces and Interfaces Committee and the TMS Electronic Device Materials Committee.