| 包封工艺对高压陶瓷电容器击穿电压的影响研究 |
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| 引用本文： | 张宾,白军平. 包封工艺对高压陶瓷电容器击穿电压的影响研究[J]. 中国陶瓷, 2010, 0(2) |
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| 作者姓名： | 张宾 白军平 |
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| 作者单位： | 佛山市科学技术学院;佛山市皓华电子有限公司; |
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| 基金项目： | 佛山市2003年度产学研专项基金资助项目,编号:2003A31 |
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| 摘 要： | 击穿电压是高压陶瓷电容器最主要的技术参数,也是最难解决的技术难题。通过不同工艺的对比实验,具体研究了环氧树脂包封工艺对高压陶瓷电容器击穿电压的影响,优化了生产工艺,使得高压陶瓷电容器耐压达到了较高的水平。
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| 关 键 词： | 高压陶瓷电容器 击穿电压 包封工艺 |
INFLUENCES OF COATING PROCEDURES ON BREAKDOWN VOLTAGE OF HIGH VOLTAGE CERAMIC CAPACITOR |
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| Zhang Bin,Bai Junping. INFLUENCES OF COATING PROCEDURES ON BREAKDOWN VOLTAGE OF HIGH VOLTAGE CERAMIC CAPACITOR[J]. China Ceramics, 2010, 0(2) |
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| Authors: | Zhang Bin Bai Junping |
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| Affiliation: | Zhang Bin1,Bai Junping2(1 Foshan University,Foshan 528000,2 Haohua Electronic Company,Foshan 528000) |
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| Abstract: | Breakdown voltage is not only a key characteristic of high voltage ceramic capacitors,but also the most difficult technical barrier.Coating technology is studied in this paper to see its influences on breakdown voltage of high voltage ceramic capacitor,Breakdown voltages are raised to very high levels after the improvements to the coating procedures. |
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| Keywords: | High Voltage Ceramic Capacitors Breakdown Voltage Coating Procedures |
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