Determining the stress required for deformation twinning in nanocrystalline and ultrafine-grained copper |
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| Authors: | Vinay Sriram Jenn-Ming Yang Jia Ye Andrew M. Minor |
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| Affiliation: | (1) Department of Materials Science and Engineering, University of California, Los Angeles, California, USA;(2) Department of Materials Science and Engineering, University of California, Berkeley and National Center for Electron Microscopy, Lawrence Berkeley National Laboratory, One Cyclotron Road, MS 72, Berkeley, CA 94720, USA |
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| Abstract: | Deformation twinning in nanocrystalline and ultrafine-grained materials has attracted much attention in recent years due to the ability of a high density of twin boundaries to dramatically improve mechanical properties such as yield strength and ductility. Various processing conditions such as ball milling, cryomilling, electrodeposition, and equi-channel angular extrusion have been used to form deformation twins in metals. Most techniques for estimating the shear stress needed to form deformation twins are based indirectly on the processing conditions. Here, a new method to directly measure the shear stress needed to form twin boundaries through in-situ transmission electron microscopy nanocompression testing will be described. |
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