Ag-Au-Pd合金键合引线中银的测定

Ag-Au-Pd合金键合引线主要用于功率芯片和组件的键合连接线。应用最多的是LED发光组件的连接。银是Ag-Au-Pd合金键合引线中的主要元素。根据实际使用要求,银含量直接影响质量、成品率和生产成本。目前国内外尚无简便准确的Ag-Au-Pd合金键合引线中银的测定方法。本文研究了用电位滴定法测定键合合金引线中质量分数为10%~90%的银。采用氯化银沉淀分离,在硫酸及硫酸铵介质中,以氯化钠标准滴定溶液,选用银复合电极,在电位滴定仪上滴定至电位突跃最大的滴定终点,经计算得到Ag-Au-Pd合金键合引线中银的准确含量。采用本方法对Ag-Au-Pd合金键合引线中的银进行8次平行的测定,相对标准偏差(RSD)在0.14%、加标回收率在95%~100.01%之间。此方法精密度好、准确度高,解决了以往直接滴定法、指示剂滴定法、火试金法及仪器测定法中诸多干扰因素的影响。为Ag-Au-Pd合金键合引线中银的含量测定提供简便精准的测量方法。

Determination of silver in Ag-Au-Pd alloy bonding leads

Ag-Au-Pd alloy bonding leads are mainly used as bonding wires for power chips and components.The most common application is the connection of LED light emitting components.Silver is the main element in Ag-Au-Pd alloy bonding leads.According to practical requirements,silver content directly affects the quality,yield and production cost.At present,there is no simple and accurate method for the determination of silver in ag-au-pd alloy bonding leads at home and abroad.In this paper,the determination of 10%~90%silver by potentiometric titration in lead wires of bonded alloys was studied.Silver chloride precipitation was used to separate,sodium chloride standard titration solution was used in sulfuric acid and ammonium sulfate medium,silver composite electrode was selected,titration was carried out on a potentiometric titration device to the titration end point with the largest potential jump,and the accurate content of silver in ag-au-pd alloy bond lead was calculated.The silver in ag-au-pd alloy bonding leads was measured in parallel for 8 times by this method.The relative standard deviation(RSD)was 0.14%and the standard recovery was 95%~100.01%.This method has good precision and high accuracy,and solves the influence of many interference factors in the previous direct titration method,indicator titration method,fire gold assay method and instrument determination method.It provides a simple and accurate method for the determination of silver content in ag-au-pd alloy bonding leads.