| 多波长集成光源阵列封装用微波馈线设计 |
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| 引用本文： | 高嘉敏,孙长征,熊兵,王健,杨舒涵,罗毅.多波长集成光源阵列封装用微波馈线设计[J].半导体光电,2019,40(3):351-354. |
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| 作者姓名： | 高嘉敏 孙长征 熊兵 王健 杨舒涵 罗毅 |
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| 作者单位： | 清华大学电子工程系北京信息科学与技术国家研究中心,北京,100084;清华大学电子工程系北京信息科学与技术国家研究中心,北京,100084;清华大学电子工程系北京信息科学与技术国家研究中心,北京,100084;清华大学电子工程系北京信息科学与技术国家研究中心,北京,100084;清华大学电子工程系北京信息科学与技术国家研究中心,北京,100084;清华大学电子工程系北京信息科学与技术国家研究中心,北京,100084 |
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| 基金项目： | 国家自然科学基金项目(61621064,61574082,51561165012)；清华大学自主科研项目(20161080068,20161080062). |
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| 摘 要： | 针对多波长集成光源阵列封装设计了一种具有低传输损耗、低串扰的阵列微波馈线。通过分析微带线和接地共面波导在传输高频微波信号时的优缺点,设计了一种桥型微波馈线结构。同时利用有限元法,对馈线尺寸参数进行仿真优化。在30GHz范围内,得到了反射系数低于-17dB、传输损耗小于0.4dB、相邻信号电极间串扰小于-26dB的仿真结果。设计了基于金线键合的阵列芯片方案,并通过有限元法仿真确定了传输性能良好的封装间距。
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| 关 键 词： | 集成光源 封装 微波馈线 传输损耗 串扰 |
| 收稿时间： | 2019/1/25 0:00:00 |
Microwave Transmission Line for The Packaging of Multiwavelength Integrated Light Source Array |
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| GAO Jiamin,SUN Changzheng,XIONG Bing,WANG Jian,YANG Shuhan and LUO Yi.Microwave Transmission Line for The Packaging of Multiwavelength Integrated Light Source Array[J].Semiconductor Optoelectronics,2019,40(3):351-354. |
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| Authors: | GAO Jiamin SUN Changzheng XIONG Bing WANG Jian YANG Shuhan and LUO Yi |
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| Affiliation: | Beijing National Research Center for Information Science and Technol., Dept. of Electronic Engin., Tsinghua University, Beijing 100084, CHN,Beijing National Research Center for Information Science and Technol., Dept. of Electronic Engin., Tsinghua University, Beijing 100084, CHN,Beijing National Research Center for Information Science and Technol., Dept. of Electronic Engin., Tsinghua University, Beijing 100084, CHN,Beijing National Research Center for Information Science and Technol., Dept. of Electronic Engin., Tsinghua University, Beijing 100084, CHN,Beijing National Research Center for Information Science and Technol., Dept. of Electronic Engin., Tsinghua University, Beijing 100084, CHN and Beijing National Research Center for Information Science and Technol., Dept. of Electronic Engin., Tsinghua University, Beijing 100084, CHN |
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| Abstract: | A microwave transmission line with low transmission loss and low crosstalk was designed for the packaging of integrated light source array. A bridge-type microwave transmission line was obtained by analyzing the advantages and disadvantages of microstrip line and grounded coplanar waveguide. Simulations based on finite element method were used to optimize the structural parameters of the transmission line, and the results show that in the fequency range of up to 30GHz, the reflection coefficient of the transmission line is less than -17dB, the transmission loss is less than 0.4dB, and the crosstalk between adjacent lanes is less than -26dB. A package design for the array chip based on wire-bonding was presented, and the distance between the array chip and the transmission line was optimized. |
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| Keywords: | integrated light source package microwave transmission line transmission loss crosstalk |
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