| 含微纳B4C/Ti颗粒铜基复合材料的微观组织与力学性能 |
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| 引用本文： | 安德成,王文先,陈洪胜,谭敏波,王苗. 含微纳B4C/Ti颗粒铜基复合材料的微观组织与力学性能[J]. 稀有金属材料与工程, 2019, 48(2): 411-418 |
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| 作者姓名： | 安德成 王文先 陈洪胜 谭敏波 王苗 |
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| 作者单位： | 太原理工大学 材料科学与工程学院,太原理工大学 材料科学与工程学院,太原理工大学 材料科学与工程学院,太原理工大学 材料科学与工程学院,太原理工大学 材料科学与工程学院 |
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| 基金项目： | 国家自然科学基金项目（面上项目，重点项目，重大项目） |
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| 摘 要： | 采用高能球磨(HEBM)和放电等离子烧结(SPS)工艺成功制备出微纳B4C/Ti颗粒增强铜基复合材料(CTBCs),通过X射线衍射(XRD)、光学显微镜(OM)、扫描电子显微镜(SEM)以及能谱(EDS)等测试手段对其微观组织形貌进行表征。结果表明,(B4C+Ti)颗粒在基体中均匀分布,增强体与铜基体界面结合良好,且其结合形式为冶金结合和机械结合并存。采用阿基米德排水法测定出烧结态试样的致密度。复合材料的显微硬度、拉伸屈服强度、抗拉强度和延伸率等力学性能相较于纯铜试样得到显著提高,这主要归因于载荷传递、细化晶粒与热错配等强化机制。复合材料的拉伸断口表现出明显的韧性断裂特征。
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| 关 键 词： | 铜基复合材料 放电等离子烧结 高能球磨 界面结合 力学性能 |
| 收稿时间： | 2017-08-01 |
| 修稿时间： | 2017-08-23 |
Microstructure Characteristics and Mechanical Properties of Cu Matrix Composites Containing Micro-B4C/nano-Ti Particulates |
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| An Decheng,Wang Wenxian,Chen Hongsheng,Tan Minbo and Wang Miao. Microstructure Characteristics and Mechanical Properties of Cu Matrix Composites Containing Micro-B4C/nano-Ti Particulates[J]. Rare Metal Materials and Engineering, 2019, 48(2): 411-418 |
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| Authors: | An Decheng Wang Wenxian Chen Hongsheng Tan Minbo Wang Miao |
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| Affiliation: | College of Materials Science and Engineering,Taiyuan University of Technology,College of Materials Science and Engineering,Taiyuan University of Technology,College of Materials Science and Engineering,Taiyuan University of Technology,College of Materials Science and Engineering,Taiyuan University of Technology,College of Materials Science and Engineering,Taiyuan University of Technology |
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| Abstract: | Micro-B4C/nano-Ti hybrid particulates reinforced copper matrix composites (CTBCs) were successfully prepared by high energy ball milling (HEBM) and spark plasma sintering (SPS). The microstructures and morphologies were characterized by X-ray diffraction (XRD), optical microscopy (OM), and scanning electron microscopy (SEM) equipped with energy dispersive spectroscopy (EDS). The results demonstrate that presence of uniformly distributed (B4C+Ti) particles and a good interfacial bond between reinforcement and the Cu matrix. Besides, the interface bondingSmechanism was metallurgical bonding and mechanical bonding. The relative density of the as-SPSed samples was tested by Archimedes drainage method. Mechanical properties (microhardness, tensile yield strength, ultimate tensile strength and elongation to fracture) of CTBCs were significantly improved in comparison to the pure copper, which was mainly due to the load transfer, grain refinement and thermal. Finally, the fracture surface of the tensile sample presented ductile fractures. |
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| Keywords: | copper matrix composites spark plasma sintering high energy ball milling interface bonding mechanical properties |
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