| LTCC基板共烧平整度工艺研究 |
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| 引用本文： | 周峻霖,夏俊生,邹建安,洪明. LTCC基板共烧平整度工艺研究[J]. 微电子学, 2011, 41(5) |
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| 作者姓名： | 周峻霖 夏俊生 邹建安 洪明 |
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| 作者单位： | 1. 华东光电集成器件研究所,安徽蚌埠,233042
2. 中国人民解放军驻九三七三厂军事代表室,安徽蚌埠,233000 |
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| 摘 要： | LTCC共烧工艺是基板加工的重要环节,有很多因素会影响产品加工进程。一般来说,从设计上要预先充分考虑,以避免负面因素影响基板共烧效果。介绍了LTCC基板/低温共烧陶瓷基板技术及共烧致密化技术的机理,阐述了LTCC平整度重要性及改善基板表面平整度工艺的优化过程。通过综合比较版图优化前后的内层金属含量、不同尺寸样品加工、结构设计等因素,经过多重试验验证,结果表明,版图优化措施切实可行,可有效提高LTCC基板共烧平整度。
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| 关 键 词： | 低温共烧陶瓷基板 平整度 共烧 |
Study on Co-Fire Process for Surface Finish of LTCC Substrate |
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| ZHOU Junlin,XIA Junsheng,ZOU Jian'an,HONG Ming. Study on Co-Fire Process for Surface Finish of LTCC Substrate[J]. Microelectronics, 2011, 41(5) |
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| Authors: | ZHOU Junlin XIA Junsheng ZOU Jian'an HONG Ming |
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| Affiliation: | ZHOU Junlin1,XIA Junsheng1,ZOU Jian'an1,HONG Ming2(1.East China Institute of Photo-Electron ICs,Bengbu,Anhui 233042,P.R.China,2.PLA Representative Office stationed at No.9373 Factory,Anhui 233000,P.R.China.) |
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| Abstract: | Co-fire process for LTCC(Low Temperature Co-fired Ceramic) is one of the important process steps for substrate processing,and many factors could have effects on the fabrication process.Therefore,it is quite necessary to take these negative effects into consideration in LTCC design.LTCC substrates and co-fire technique were presented,as well as mechanism of co-fire densification process.Optimization process to improve surface finish of LTCC substrate was described.Comprehensive comparisons were made on metal... |
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| Keywords: | LTCC substrate Surface finish Co-fire |
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