| 基于功率型LED散热技术的研究 |
| |
| 引用本文： | 刘一兵,黄新民,刘国华.基于功率型LED散热技术的研究[J].照明工程学报,2008,19(1):69-73. |
| |
| 作者姓名： | 刘一兵 黄新民 刘国华 |
| |
| 作者单位： | 1. 湖南大学,信息与电气工程学院,湖南,长沙,410082
2. 邵阳职业技术学院机电工程系,湖南,邵阳,422000 |
| |
| 摘 要： | 散热制约了LED功率的进一步提高。本文在分析功率LED受热效应影响的基础上,从改进LED结构角度来解决散热问题。芯片采用倒装焊结构,可降低热阻,提高散热能力,对倒装焊结构的热能扩散途径进行了阐述,指出采用导热性能优良的封装材料是提高散热效率的重要途径。并对密封材料,键合材料,散热基板对散热的影响作了详细的分析,最后介绍了采用热沉散热的最新进展,并提出了今后的研究方向。
|
| 关 键 词： | 功率LED 散热 倒装焊 封装材料 |
Research of Heat Release Technology of Based on Power-LED |
| |
| Liu Yibing,Huang Xinmin,Liu Guohua.Research of Heat Release Technology of Based on Power-LED[J].China Illuminating Engineering Journal,2008,19(1):69-73. |
| |
| Authors: | Liu Yibing Huang Xinmin Liu Guohua |
| |
| Affiliation: | Liu Yibing ,Huang Xinmin ,Liu Guohua (1. College of electrical and information engineering, Hunan Urtiversity , Changsha, 410082; 2. Department of mechanical and electric, shaoyang professional-technology college, shaoyang 422000) |
| |
| Abstract: | Heat release has resisted more improvment of LED powers.On the foundation of heat effect of power-LED,point out solution method of heat releae by changing LED structure.The chip that used flip-chip structure could reduce heat resistance and improve heat release.Summrized thermal dispersion channel of flip-chip structure.Point out that Using Packaging materials with high thermal conductivity is important for improving heat release efficiency.The heat release impact becase of packaging material,die bonding material ane thermal spreading substracte are analysized.At last,the later progresses that used for sink cooling were introduced and pointed out further research direction. |
| |
| Keywords: | power-LED heat release flip-chip packaging material |
| 本文献已被 CNKI 维普 万方数据 等数据库收录！ |
|
