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传感技术中的硬件软化
引用本文:涂象初.传感技术中的硬件软化[J].北京工业大学学报,1988(3).
作者姓名:涂象初
作者单位:北京工业大学无线电电子学系
摘    要:利用微型计算机及其智能软件来仿效有关领域专家的设计思想,可使相应仪器仪表中的硬件结构减至最小限度,同时还提高了仪器仪表的功能:热电偶参考端智能补偿的精度优于0.02℃,所能补偿的环境温度范围为-200~+650℃,变压降节流式流量测量系统的在线自设计精度则优于0.2%。

关 键 词:传感技术  智能补偿  自适应测量  仪器仪表中的硬件软化

Softenization of Hardware in the Transducer Technique
Tu Xiangchu.Softenization of Hardware in the Transducer Technique[J].Journal of Beijing Polytechnic University,1988(3).
Authors:Tu Xiangchu
Affiliation:Tu Xiangchu
Abstract:Mcrocomputer and an intelligent software embodied are used, so as to simulate expert's design ideas to minimize the hardware construction in related instrument and to improve its function, intelligent compensation accuracy of the reference junction of thermocouple can be better than 0.02℃, whereas the compensable temperature range of the circumstance is-200-650℃; the on-line design accuracyof flow measurement system with a variable pressure-drop type throtlling element is better than 0.2%.
Keywords:Transducer technique  AI compensation  Adaptive measurement  Softenization of hardware in instruments  
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