Synthesis of thermosetting poly(phenylene ether) containing allyl groups |
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Authors: | Toshiaki Fukuhara |
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Affiliation: | Department of Organic and Polymeric Materials, Graduate School of Science and Engineering, Tokyo Institute of Technology, 2-12-1, O-okayama, Meguro-ku, Tokyo 152-8552, Japan |
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Abstract: | New thermosetting poly(2-allyl-6-methylphenol-co-2,6-dimethylphenol)s (3) have been developed by oxidative coupling copolymerization of 2-allyl-6-methylphenol (1) with 2,6-dimethylphenol (2), followed by thermal curing. Copolymerization was conducted in nitrobenzene in the presence of copper(I) chloride and pyridine as the catalyst under a stream of oxygen, producing high molecular weight copolymers (Mn∼50,000) with broad molecular weight distributions (Mw/Mn∼35). The structure of resulting copolymers 3 was characterized by IR, 1H, and 13C NMR spectroscopy. Cross-linking reactions of copolymers were carried out by thermal treatment in the absence or presence of a peroxide (3 wt%, 2,5-dimethyl-2,5-di(tert-butylperoxy)-3-butane). The 10% weight loss and glass transition temperatures of the cured copolymers were 436 °C in nitrogen and 235 °C, respectively after curing at 70 °C for 1 h and 300 °C for 1 h. The average refractive index of the cured copolymer (3b) film was 1.5407, from which the dielectric constant (ε) at 1 MHz was estimated as 2.6. The ε and dissipation factor of copolymer-films at 1 MHz were directly measured from their capacitances as 2.5-2.6 and 0.0015-0.0019, respectively. |
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Keywords: | Dielectric properties Low k materials Oxidative coupling polymerization |
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