半导体封装形式介绍

半导体器件有许多封装型式,从DIP、SOP、QFP、PGA、BGA到CSP再到SIP,技术指标一代比一代先进,这些都是前人根据当时的组装技术和市场需求而研制的。总体说来,它大概有三次重大的革新:第一次是在上世纪80年代从引脚插入式封装到表面贴片封装,极大地提高了印刷电路板上的组装密度;第二次是在上世纪90年代球型矩正封装的出现,它不但满足了市场高引脚的需求,而且大大地改善了半导体器件的性能;晶片级封装、系统封装、芯片级封装是现在第三次革新的产物,其目的就是将封装减到最小。每一种封装都有其独特的地方,即其优点和不足之处,而所用的封装材料,封装设备,封装技术根据其需要而有所不同。驱动半导体封装形式不断发展的动力是其价格和性能。

Semiconductor Package Introduction

Semiconductor devices have so many assembly features, such as DIP, SOP, QFP, PGA, BGA, CSP and SIP etc, all these packages were developed by dedicated people in the last 40 years according to assembly technology and marketing requirements of the time in order to get higher performance and reliability. General speaking, It has three significant steps of innovation: first is the translation to surface mounting package from through hole package in the end of last eighties, it significantly increase the density of printed wire board; Second step is emergence of ball grid array in the nineties of 20 century, it not only meets very high pin requirement, but also has higher performance especially in high frequency device; we are on third step now, many companies are developing Chip Scale Package (CSP) System In Package (SIP) , Wafer Level Scale Package (WLSP) etc to get the highest density. Every package have it's advantage and disadvantage, and maybe use different assembly technology, material and equipment. It is the lower price and high performance of each device that drive semiconductor package to advance continuously.