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Megasonic agitation for enhanced electrodeposition of copper |
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| Authors: | Jens Georg Kaufmann Marc P Y Desmulliez Yingtao Tian Dennis Price Mike Hughes Nadia Strusevich Chris Bailey Changqing Liu David Hutt |
| Affiliation: | 1. MicroSystems Engineering Centre (MISEC), School of Engineering and Physical Science, Heriot-Watt University, Earl Mountbatten Building, Edinburgh, EH14 4AS, UK 2. Wolfson School of Mechanical and Manufacturing Engineering, Loughborough University, Loughborough, Leicestershire, LE11 3TU, UK 3. Merlin Circuit Technology LTD, Harwarden Industrial Park, Manor Lane, Deeside, Flintshire, West Wales, CH5 3QZ, UK 4. Centre for Numerical Modelling and Process Analysis (CNMPA), University Of Greenwich, Park Row, Greenwich, London, SE10 9LS, UK |
| Abstract: | In this paper we propose an agitation method based on megasonic acoustic streaming to overcome the limitations in plating rate and uniformity of the metal deposits during the electroplating process. Megasonic agitation at a frequency of 1 MHz allows the reduction of the thickness of the Nernst diffusion layer to less than 600 nm. Two applications that demonstrate the benefits of megasonic acoustic streaming are presented: the formation of uniform ultra-fine pitch flip-chip bumps and the metallisation of high aspect ratio microvias. For the latter application, a multi-physics based numerical simulation is implemented to describe the hydrodynamics introduced by the acoustic waves as they travel inside the deep microvias. |
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