Study on the effect of DIC deformation sensor on mechanical property of substrate |
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Affiliation: | 1. School of Physics and Materials Science, Anhui University, Hefei 230039, PR China;2. School of Science, Anhui University of Science and Technology, Huainan 232001, PR China;3. Shanghai Institute of Technical Physics of the Chinese Academy of Sciences, Shanghai 200083, PR China;4. School of Chemistry and Chemical Engineering, Linyi University, Linyi 276000, PR China;1. LORIA, UMR CNRS 7503, Université de Lorraine, CNRS, INRIA project-team Magrit; Campus Scientifique, BP 239, 54506 Vandœuvre-lès-Nancy Cedex, France;2. Institut Pascal, UMR CNRS 6602, Université Blaise Pascal, CNRS; BP 10448, 63000 Clermont-Ferrand, France |
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Abstract: | The thin epoxy film with micro-scale speckle pattern as a digital image correlation (DIC) deformation sensor has been fabricated or transferred on the surface of sample in the previous study. When the thickness of the film cannot be ignored, it may have an influence on the validity of measurement results. And thus, the influence of the thin epoxy film on mechanical properties of substrates should be investigated. In this study, the mechanical behavior of thin film itself and surface strain of composite structure of thin film and substrate were measured using micro digital image correlation (MDIC) method. And theoretical and simulative results were also analyzed. From the comparison analysis of theoretical, simulative and experimental results, it is concluded that when the ratios of Young’s modulus and thickness between the film and substrate are smaller than 13 and 0.5 respectively, the influence from the thin film can be ignored, and thin epoxy film as DIC sensor can be used to measure the deformation of substrate. |
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Keywords: | Thin epoxy film DIC sensor MDIC method Mechanical behavior |
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