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Sintering behavior of W–30Cu composite powder prepared by electroless plating
Affiliation:1. College of Material Science and Engineering, Hefei University of Technology, Hefei 230009, China;2. Institute of Plasma Physics, Chinese Academic Sciences, Hefei 230031, China;3. Engineering Research Center of Powder Metallurgy of Anhui Province, Hefei 230009, China;1. School of Materials Science and Engineering, Hefei University of Technology, Hefei 230009, China;2. Anhui Province Key Lab of Aerospace Structural Parts Forming Technology and Equipment, Institute of Industry and Equipment Technology, Hefei University of Technology, Hefei 230009, China;3. National-Local Joint Engineering Research Centre of Nonferrous Metals and Processing Technology, Hefei 230009, China;4. Engineering Research Center of High Performance Copper Alloy Materials and Processing, Ministry of Education, Hefei 230009, China;5. Institute for Integrated Radiation and Nuclear Science, Kyoto University, Osaka-fu 590-0494, Japan;1. School of Materials Science and Engineering, Central South University, Changsha 410083, China;2. Key Laboratory of Nonferrous Metal Materials Science and Engineering, Ministry of Education, Changsha 410083, China
Abstract:Powder metallurgy technique was employed to prepare W–30 wt.% Cu composite through a chemical procedure. This includes powder pre-treatment followed by deposition of electroless Cu plating on the surface of the pre-treated W powder. The composite powder and W–30Cu composite were characterized by X-ray diffraction (XRD) and field emission scanning electron microscopy (FE-SEM). Cold compaction was carried out under pressures ranging from 200 MPa to 600 MPa while sintering at 850 °C, 1000 °C and 1200 °C. The relative density, hardness, compressive strength, and electrical conductivity of the sintered samples were investigated. The results show that the relative sintered density of the titled composites increased with the sintering temperature. However, in solid sintering, the relative density increased with pressure. At 1200 °C and 400 MPa, the liquid-sintered specimen exhibited optimum performance, with the relative density reaching as high as 95.04% and superior electrical conductivity of IACS 53.24%, which doubles the national average of 26.77%. The FE-SEM microstructure evaluation of the sintered compacts showed homogenous dispersion of Cu and W and a Cu network all over the structure.
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