Measurement of thermal expansion coefficient of INVAR foil using atomic force microscopy |
| |
| Affiliation: | 1. Department of Applied Materials and Optoelectronic Engineering, National Chi Nan University, Taiwan, ROC;2. Department of Electrical Engineering, National Chi Nan University, Taiwan, ROC;3. Department of Chemical and Materials Engineering, National University of Kaohsiung, Kaohsiung, Taiwan, ROC;1. LMT (CNRS/ENS), Cachan, France;2. MATEIS (CNRS/INSA/University of Lyon), Villeurbanne, France;1. School of Materials Science and Engineering, Hefei University of Technology, Hefei 230009, China;2. Electric Power Research Institute, State Grid Anhui Electric Power Co., Ltd., Hefei, Anhui, 230601, China;3. 43 Institute, China Electronics Technology Group Corporation, Hefei 230088, China;4. Anhui Province Key Laboratory of Microsystem, Hefei 230088, China;5. Hefei Shengda Electronic Technology Industry Co. Ltd., Hefei 230088, China;6. Engineering Research Center of High-performance Copper Alloy Materials and Processing, Ministry of Education, Hefei 230009, China;1. Department of Energy Technology, Aalborg University, Pontoppidanstraede 111, Aalborg DK-9220, Denmark;2. JBS Solutions Inc., Supporting the Engineering and Science Services Capabilities Augmentation (ESSCA) contract at the NASA Marshall Space Flight Center, Huntsville, AL 35808, USA;1. Department of Physics, National Institute of Technology, Surathkal, 575025, Karnataka, India;2. Department of Physics, NMAM Institute of Technology, Nitte, 574110, Karnataka, India |
| |
| Abstract: | The production of organic light emitting diode (OLED) displays depends on the use of the low coefficient of thermal expansion (CTE) of INVAR foils as the shadow mask. The high-resolution of the smartphone displays requires increasingly thin INVAR in a two-step etching process. However, it is difficult to measure CTE for very thin metal foils. A simple method is developed to measure the linear CTE of the INVAR foil using atomic force microscopy (AFM). This method uses a focus-ion-beam (FIB) to etch a 5000 μm trench on the INVAR foil. The thermal drift of the system is calibrated from AFM images, and the average linear CTE of the INVAR foil is then calculated from the displacements of two side end points of the trench on the foil during temperature variation. The linear CTE obtained by the proposed method is quite close to the value of the bulk INVAR provided by the manufacturer. |
| |
| Keywords: | Linear coefficient of thermal expansion INVAR Atomic force microscopy |
| 本文献已被 ScienceDirect 等数据库收录！ |
|
