基于ANSYS Icepak的热管模块设计与仿真分析

NVIDIA JETSON TX2高功率系统芯片的散热功率一般在25 W左右，一般的风扇与肋片式散热器组合的散热方式存在体积大、高度高、不方便整合在小型系统中等问题，而热管、风扇、铜鳍片散热器组合的散热方式具有高度低、体积小、传热效率高等优点。文中首先对热管模块进行结构设计；然后对热管模块设计的合理性进行计算验证，并利用ANSYS Icepak对热管模块进行热稳态仿真，发现主要芯片的温度都在要求范围内，表明设计合理；最后将热管模块装入系统进行温度测试。结果表明，主要芯片的计算、仿真与实验的温度基本一致。

Design and Simulation Analysis of Heat Pipe Module Based on ANSYS Icepak

The heat dissipation power of NVIDIA JETSON TX2 high-power system chips is generally around 25 W. The heat dissipation method of combining a fan and a finned heat sink has the problems of large volume, high height and inconvenient integration into small system. The combination of heat pipe, fan and copper fin radiator has the advantages of low height, small volume and high heat transfer efficiency. First, the structure design of the heat pipe module is carried out. Then, the rationality of the design is calculated and verified. ANSYS Icepak is used to conduct thermal steady-state simulation for the heat pipe module. It is found that the temperatures of the main chips are all within the required range, which verifies the rationality of the design. Finally, the heat pipe module is installed into the system for temperature test. The results indicate that the temperature results of the main chips obtained from calculation, simulation and experiment are basically consistent.