| 氰酸酯树脂/聚苯醚/纳米二氧化硅电子封装材料固化动力学研究 |
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| 引用本文： | 张梦萌,颜红侠,管兴华,王倩倩.氰酸酯树脂/聚苯醚/纳米二氧化硅电子封装材料固化动力学研究[J].中国塑料,2012(4):40-44. |
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| 作者姓名： | 张梦萌 颜红侠 管兴华 王倩倩 |
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| 作者单位： | 西北工业大学理学院应用化学系 |
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| 摘 要： | 采用硅烷偶联剂表面处理过的纳米二氧化硅作为无机填料改性氰酸酯树脂/聚苯醚固化体系,并利用非等温差示扫描量热法研究了氰酸酯树脂/聚苯醚/纳米二氧化硅电子封装材料的固化动力学。结果表明,氰酸酯树脂/聚苯醚/3%纳米二氧化硅固化体系的凝胶温度为150℃、固化温度为181℃、后处理温度为239℃;固化动力学参数表观活化能为15.46kJ/mol、反应级数为0.82、频率因子为38174.38s-1;加入纳米二氧化硅可以降低氰酸酯树脂/聚苯醚固化体系的表观活化能,使其固化反应可以在较低温度下进行。
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| 关 键 词： | 氰酸脂树脂 聚苯醚 纳米二氧化硅 固化动力学 |
Study on Curing Kinetics of Cyanate Ester/Polyphenylene Oxide/Nano-SiO2 Electronic Encapsulating Material |
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| ZHANG Mengmeng,YAN Hongxia, GUAN Xinghua,WANG Qianqian.Study on Curing Kinetics of Cyanate Ester/Polyphenylene Oxide/Nano-SiO2 Electronic Encapsulating Material[J].China Plastics,2012(4):40-44. |
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| Authors: | ZHANG Mengmeng YAN Hongxia GUAN Xinghua WANG Qianqian |
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| Affiliation: | (Department of Applied Chemistry,School of Science,Northwestern Polytechnical University,Xi’an 710129,China) |
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| Abstract: | Silane treated nano-silica was introduced into cyanate ester resin/polyphenylene oxide curing system as inorganic filler.Kinetic analysis of cyanate ester/polyphenylene oxide/nano-SiO2 was carried out using differential scanning calorimetry.It showed that the process parameters and curing kinetics parameters of cyanate ester/polyphenylene oxide/3 % nano-SiO2 curing system were obtained as follows:gel temperature 150 ℃,curing temperature 181 ℃,post-treating temperature 239 ℃.The curing kinetic parameters were: apparent activation energy 15.46 kJ/mo1,reaction order 0.82,frequency factor 38174.38 s-1,respectively.The addition of nano-SiO2 could lower the activation energy of cyanate ester resin/polyphenylene oxide curing system and the curing reaction could occur at a relative lower temperature. |
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| Keywords: | cyanate ester polyphenylene oxide nano-silica curing kinetics |
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