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测量微小粒子高度的显微投影方法研究
引用本文:唐春晓,李恩邦,吴亚北. 测量微小粒子高度的显微投影方法研究[J]. 激光与光电子学进展, 2012, 0(8): 90-94
作者姓名:唐春晓  李恩邦  吴亚北
作者单位:天津工业大学电子与信息工程学院;西南交通大学信息科学与技术学院
基金项目:国家自然科学基金(60877049,61177078);高等学校博士学科点专项科研基金(20101201120001)资助课题
摘    要:在半导体生产过程中,半导体基片在生长制作时表面会存在一些细微突起的结构,这些突起的尺寸通常为微米量级,若突起的尺寸过高,在流水线上被打磨抛光时极易产生不合格的产品,从而影响生产效率。因此,需对平面上单一(或几个稀疏分布的)非球形粒子的高度进行实时在线测量。针对这一问题提出了一种测量微小粒子高度的方法:显微投影法。介绍了基于显微投影法的微小粒子高度测量系统,实现了约100μm高度的单一不规则形状微小粒子的测量。

关 键 词:测量  图像处理  显微成像  投影光学

Research of Minute-Particle Height Measurement Method Based on Microscopic Imaging and Projection Optics
Tang Chunxiao,Li Enbang,Wu Yabei. Research of Minute-Particle Height Measurement Method Based on Microscopic Imaging and Projection Optics[J]. Laser & Optoelectronics Progress, 2012, 0(8): 90-94
Authors:Tang Chunxiao  Li Enbang  Wu Yabei
Affiliation:1School of Information and Communication Engineering,Tianjin Polytechnic University, Tianjin 300387,China 2School of Information Science and Technology,Southwest Jiaotong University, Chengdu,Sichuan 610031,China
Abstract:There are some minute peaked particles on the surface of semiconductor substrate during production.Sizes of the particles are usually several microns.If the height of any particle exceeds a standard value,there will be many defect wares during snagging and buffing when processed on the assembly-line.All that could affect the producing efficiency.It is desired to give test simultaneously on the height of single or several sparsely distributed non-spherical particles.We aim at offering a method to measure the height of minute particles.We also introduce a system of measuring small particle′s height on the basis of microscopic projection and successfully measure single randomly shaped minute particle with height around 100 μm.
Keywords:measurement  image processing  microscopic imaging  projection optics
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