热风整平助焊剂的研制

以两性表面活性剂(自制)、光亮剂、消烟剂、活化剂及混合溶剂为原料,配制热风整平助焊剂。探讨组分配比对241~243℃热风整平后印制板焊盘、孔涂铅锡的光亮度、饱满度、红孔及烟大小等的影响。结果表明,助焊剂的最佳组成为两性表面活性剂65%,光亮剂6.5%,消烟剂0.9%,活化剂0.75%,其余为溶剂。焊盘、孔铅锡光亮、饱满、无红孔、烟小,达到印制电路板生产要求。

Study on preparation of hot-air solder leveling soldering aid

Hot-air solder leveling soldering fluid was made from amphiprotic surface active agent,bright agent,antismoke agent,activating agent and component solvent.In 241～243 ℃,the effect of various component amount on PCB bonding pads which were treated by hot-air solder leveling,the brightness and fullness of lead-tin solder in hole,red-hole and exhaust smoke level were studied.The result showed that:the best composition of soldering fluid were amphiprotic surface active agent is 65%,bright is 6.5%,antismoke agent is 0.9%,activating agent is 0.75%,the rest is solvent.Lead-tin solder on bonding pads and holes was bright and full,no red-hole,low exhaust smoke lever,which can meet the requirement of PCB produce.