| 高性能计算机系统MGH串行背板设计 |
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| 引用本文： | 曹跃胜,李晋文,胡军.高性能计算机系统MGH串行背板设计[J].计算机工程与科学,2009,31(Z1). |
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| 作者姓名： | 曹跃胜 李晋文 胡军 |
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| 作者单位： | 国防科技大学计算机学院,湖南,长沙,410073 |
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| 基金项目： | 国家自然科学基金资助项目 |
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| 摘 要： | 高性能计算机和通信系统的互连传输速率超过10Gbps,信号频谱高端已达数10GHz(MGH)以上。本文分析了MGH背板的互连方式,讨论了高性能PCB板材和连接器的性能和应用能力。针对MGH背板高速率串行传输的信号完整性设计要求,提出采用小角度布线、反钻和双直径过孔的设计技术,并在工程设计中得到了成功应用。
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| 关 键 词： | 背板 信号完整性 印制板材料 连接器 过孔 高速串行传输 |
The Design of Mlti-GigaHertz Serial-Link Backplane in High Performance Computer System |
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| CAO Yue-sheng,LI Jin-wen,HU Jun.The Design of Mlti-GigaHertz Serial-Link Backplane in High Performance Computer System[J].Computer Engineering & Science,2009,31(Z1). |
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| Authors: | CAO Yue-sheng LI Jin-wen HU Jun |
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| Affiliation: | CAO Yue-sheng,LI Jin-wen,HU Jun(School of Computer Science,National University of Defense Technology,Changsha 410073,China) |
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| Abstract: | The transmit rates of SERDES have approached 10 Gbps in high performance computer and telecom system,the high-end of frequency spectra in the serial links even reached over Multi-GigaHertz. This article has discussed the link method on MGH backplane. The key parameters and the application of high-performance printed circuit board (PCB) materials and backplane connectors have been presented. For achieving reliable transmission and signal integrity in the design of MGH backplane, this article proposes the angled (or zigzag) routing method, as well as the technoques of backdrilling via and dual diameter via,and these techniques have been successful applied in practical project. |
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| Keywords: | backplane signal integrity PCB material connector via SERDES |
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