| 全铜通孔柔性LED封装热学性能仿真分析 |
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| 引用本文： | 刘洋,张国旗,孙凤莲.全铜通孔柔性LED封装热学性能仿真分析[J].半导体学报,2015,36(6):064011-4. |
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| 作者姓名： | 刘洋 张国旗 孙凤莲 |
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| 基金项目： | 黑龙江省教育厅科研项目 No. 12541112 |
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| 摘 要： | 柔性基板封装(COF)是一种新型LED封装形式。本研究在柔性基板中的高分子绝缘层(PI)中添加全铜通孔，通过有限元仿真分析全铜通孔对LED封装热学性能的影响。研究结果表明：在柔性LED封装中，PI层热阻最大，是导致芯片结温高的主要因素。PI层中全铜通孔的添加使PI层热阻大幅降低，显著提升LED封装的垂直散热能力。基于仿真计算结果，建立了PI层中添加全铜通孔数量与LED封装热阻间的对应关系。针对本研究中的封装结构，采用8*8 的全铜通孔阵列对LED封装的热学性能提升效果显著。
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| 关 键 词： | COF LED Cu-pillar thermal performance FE simulation |
Thermal simulation of flexible LED package enhanced with copper pillars |
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| Liu Yang,Zhang Guoqi and Sun Fenglian.Thermal simulation of flexible LED package enhanced with copper pillars[J].Chinese Journal of Semiconductors,2015,36(6):064011-4. |
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| Authors: | Liu Yang Zhang Guoqi and Sun Fenglian |
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| Affiliation: | 1. School of Material Science and Engineering, Harbin University of Science and Technology, Harbin 150040, China;Beijing Research Centre, Delft University of Technology, Beijing 100083, China;State Key Laboratory of Solid State Lighting, Changzhou 213161, China;2. Beijing Research Centre, Delft University of Technology, Beijing 100083, China;State Key Laboratory of Solid State Lighting, Changzhou 213161, China;3. Beijing Research Centre, Delft University of Technology, Beijing 100083, China;Institute of Semiconductors, Chinese Academy of Sciences, Beijing 100083, China;State Key Laboratory of Solid State Lighting, Changzhou 213161, China;4. Institute of Semiconductors, Chinese Academy of Sciences, Beijing 100083, China;DIMES Center for SSL Technologies, Delft University of Technology, Delft 2628CT, Netherlands;5. School of Material Science and Engineering, Harbin University of Science and Technology, Harbin 150040, China |
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| Abstract: | Chip on flexible substrate (COF) is a new packaging technology for light emitting diodes (LED). This paper investigated the effect of Cu-pillar in the polyimide (PI) layer on the thermal properties of COF LED packages by finite element analysis. The thermal distribution and thermal resistance were studied in both COF LED packages with and without Cu-pillar. The PI layer showed the highest thermal resistance in the typical package and led to a high chip temperature. With the addition of Cu-pillars, however, the thermal resistance of the PI layer significantly decreased due to the improvement of vertical thermal dissipation under LED chips. Based on the results of simulation and calculation, the relationship between the amount of Cu-pillar and thermal resistance of the COF package has been built. For the packages studied in this research, an 8 × 8 Cu-pillars array was adequate to improve the thermal performance of COF packages. |
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| Keywords: | COF LED Cu-pillar thermal performance FE simulation |
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