| 多界面脱粘红外无损检测中热激励方法的研究 |
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| 引用本文： | 樊丹丹,潘晋孝,刘宾,刘子龙.多界面脱粘红外无损检测中热激励方法的研究[J].激光与红外,2011,41(3):284-287. |
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| 作者姓名： | 樊丹丹 潘晋孝 刘宾 刘子龙 |
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| 作者单位： | 中北大学,信息探测与处理技术研究所,山西太原030051 |
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| 基金项目： | 国家自然科学基金（No.60772102）；国防重点实验室基金（No.9140c12040051010）资助 |
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| 摘 要： | 红外热波检测中热激励方法的选择直接影响缺陷的可检出性和实际检测效果。本文对薄粘接层的界面脱粘检测中的热激励方法进行了分析比较。通过构建多界面脱粘缺陷模型，用有限元分析软件COMSOL对不同热激励下脱粘的红外无损检测做仿真计算，研究热激励方法与检测灵敏度之间的关系，为制定准确的红外检测实验方案提供数值依据。
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| 关 键 词： | 红外无损检测 脱粘 热激励 有限元分析 |
Research of thermal excitation method in infrared NDT for multiple interface debonding |
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| FAN Dan-dan,PAN Jin-xiao,LIU bin,LIU Zi-long.Research of thermal excitation method in infrared NDT for multiple interface debonding[J].Laser & Infrared,2011,41(3):284-287. |
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| Authors: | FAN Dan-dan PAN Jin-xiao LIU bin LIU Zi-long |
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| Affiliation: | Institute of Signal Capturing and Processing Technology,North University of China,Taiyuan 030051,China |
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| Abstract: | The method of thermal excitation directly influences the defect detection and actual test results in infrared NDT.In the paper,the thermal excitation methods are analysed and compared in thin adhesive layer interface debonding detection.We simulate the different thermal excitations in infrared NDT with finite element analysis software COMSOL by constructing a defect model of multi-layered interface debonding.The research of the relationship between simulation results and thermal excitations provides foundation for accurate infrared NDT experiment. |
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| Keywords: | infrared NDT debond thermal excitation finite element analysis |
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