首页 | 本学科首页   官方微博 | 高级检索  
     

可应用于光互连的新型高带宽、高灵敏度差分光接收机的概念提出与设计
引用本文:余长亮,毛陆虹,宋瑞良,肖新东.可应用于光互连的新型高带宽、高灵敏度差分光接收机的概念提出与设计[J].半导体学报,2008,29(5).
作者姓名:余长亮  毛陆虹  宋瑞良  肖新东
作者单位:天津大学电子信息工程学院,天津,300072
基金项目:国家自然科学基金,天津市自然科学基金
摘    要:提出了一种可应用于高速光通信和光互连的新型高带宽、高灵敏度差分光接收机.其中,高带宽和高灵敏度分别通过输入负载平衡的全差分跨阻前置放大器和将入射光信号转换成一对差分光生电流信号的两个光电探测器来实现.与常用光接收机相比,这种新型光接收机无任何附加成本.设计了一种相应的、与0.35μm标准CMOS工艺完全兼容的光电集成接收机.其中,光电探测器采用面积为60μm×30μm、结电容为1.483pF的插指型p+/n-well/p-substrate光电二极管.仿真结果表明:该光电集成接收机的带宽为1.37GHz;跨阻增益为81.9dBΩ;面积为0.198mm2;数据传输率至少可达2Gb/s;对于215-1位的输入伪随机码序列(PRBS),在误码率为10-12条件下,灵敏度至少可达-13dBm.

关 键 词:高带宽  高灵敏度  CMOS  光接收机

Concept and Design of a Novel High-Bandwidth, High-Sensitivity Differential Receiver for Optical Interconnections
Yu Changliang,Mao Luhong,Song Ruiliang,Xiao Xindong.Concept and Design of a Novel High-Bandwidth, High-Sensitivity Differential Receiver for Optical Interconnections[J].Chinese Journal of Semiconductors,2008,29(5).
Authors:Yu Changliang  Mao Luhong  Song Ruiliang  Xiao Xindong
Abstract:A novel high-bandwidth,high-sensitivity differential optical receiver without any additional cost compared togeneral optical receivers, is proposed for high-speed optical communications and interconnections. High bandwidth andhigh sensitivity are achieved through a fully differential transimpedance amplifier with balanced input loads and two pho-todetectors to convert the incident light into a pair of differential photogenerated currents, respectively. In addition, a cor-responding 0. 35μm standard CMOS optoelectronic integrated receiver with two 60μm × 30μm, 1. 483pF fingered p+/n-well/p-substrate photodiodes is also presented. The simulation results demonstrate that it achieves a 1.37GHz bandwidthand a 81.9dBΩ transimpedance gain, supporting data rates up to at least 2Gbit/s. The device consumes a core area of0. 198ram2 and the optical sensitivity is at least - 13dBm for a 10-12 bit error rate under a 215 - 1 PRBS input signal.
Keywords:high-bandwidth  high-sensitivity  CMOS  optical receiver
本文献已被 万方数据 等数据库收录!
点击此处可从《半导体学报》浏览原始摘要信息
点击此处可从《半导体学报》下载全文
设为首页 | 免责声明 | 关于勤云 | 加入收藏

Copyright©北京勤云科技发展有限公司  京ICP备09084417号