| 塑封双极型功率晶体管的失效与案例分析 |
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| 引用本文： | 霍玉杰,陈颖,谢劲松.塑封双极型功率晶体管的失效与案例分析[J].半导体技术,2008,33(1):86-89. |
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| 作者姓名： | 霍玉杰 陈颖 谢劲松 |
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| 作者单位： | 北京航空航天大学,可靠性工程研究所,北京,100083 |
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| 摘 要： | 由于其自身的结构与封装形式,塑封双极型功率管存在很多可靠性问题.介绍了塑封双极型功率晶体管可靠性问题及失效机理,包括封装缺陷、粘结失效以及由于温度变化而引起的热应力失效和由于吸入潮气而导致的腐蚀失效.通过剖析一晶体管的失效机理,给出了对此类晶体管失效分析的方法和思路.讨论了晶体管存在异物、芯片粘结失效和热应力失效等失效模式.
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| 关 键 词： | 双极型 晶体管 失效机理 失效分析 |
| 文章编号： | 1003-353X（2008）01-0086-04 |
| 收稿时间： | 2007-07-03 |
| 修稿时间： | 2007年7月3日 |
Failure Analysis and Case Study of Plastic Capsulation Power Bipolar Transistor |
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| Huo Yujie,Chen Ying,Xie Jinsong.Failure Analysis and Case Study of Plastic Capsulation Power Bipolar Transistor[J].Semiconductor Technology,2008,33(1):86-89. |
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| Authors: | Huo Yujie Chen Ying Xie Jinsong |
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| Affiliation: | Huo Yujie,Chen Ying,Xie Jinsong(Institute of Reliability Engineering,Beijing Univ.of Aeronautics , Astronautics,Beijing 100083,China) |
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| Abstract: | Plastic capsulation power bipolar transistor exists many reliability problems due to the structure and package style. The reliability problems and failure mechanism were summarized, including technology defects such as package defects, adhesion defects, thermal stress caused by temperature variation, and erosion by humidity intrusion. Some of failure mechanism cases were given to show the considerations and solutions for analyzing failures mechanism. The cases include foreign matter failure, chip adhesion failure and thermal stress failure, etc. |
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| Keywords: | bipolar transistor failure mechanism failure analysis |
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