Physics-of-failure assessment methodology for power electronic systems |
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| Affiliation: | 1. CALCE/Department of Mechanical Engineering, University of Maryland, College Park, MD 20742, United States;2. ABB Switzerland Ltd., Corporate Research, Segelhofstrasse 1K, 5405 Baden-Dättwil, Switzerland;1. Le2i, UMR CNRS 6306, University of Burgundy, 9 Avenue Alain Savary, 21000 Dijon, France;2. Centre National d’Etudes Spatiales (CNES), 18 Avenue Edouard Belin, 31401 Toulouse, France;1. STMicroelectronics, 850, rue Jean Monnet, 38926 Crolles Cedex, France;2. Laboratory of Computer Sciences, Paris 6 (LIP6), Systems On Chips Department, UPMC University, 4 place Jussieu, 75252 Paris Cedex 05, France;1. Engineering Product Development Pillar, Singapore University of Technology and Design, Singapore 138 682, Singapore;2. Department of Mechanical Engineering, Massachusetts Institute of Technology, Cambridge, MA 02139, USA;1. Departament d’Enginyeria Electrònica, Universitat Autònoma de Barcelona, Cerdanyola del Valles, Spain;2. Departamento de Electricidad y Electrónica, Universidad de Valladolid, Valladolid, Spain;3. Department of Chemistry, University of Helsinki, Helsinki, Finland;1. SAGE-ENISo, National Engineering School of Sousse, 4023 University of Sousse, Tunisia;2. Al Leith Engineering College, Umm Al-Qura University, Saudi Arabia;3. ISIM, University of Gabes, 6072 Gabes, Tunisia;4. ESTACA Research Center, 92532 Levallois Perret, Paris, France;5. GPM-UMR CNRS 6634, University of Rouen, 76801 Saint Etienne du Rouvray, France |
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| Abstract: | Driven by consumer markets and industrial needs, power electronic systems are operating at higher power densities, in smaller packages and in more exotic environments. As these trends continue, ensuring long-term operation in harsher conditions requires accurate reliability prediction models, most viably obtained through Physics-of-Failure (PoF) methodologies. This paper introduces a PoF-based system-level reliability assessment procedure in which the dominant failure mechanisms are identified for three primary subsystems: the power module, DC-link capacitors and the control circuitry. This report outlines the dominant failure modes and mechanisms for each subsystem and provides examples of how to improve subsystem reliability based upon the described assessment methodology. A case study is also presented in which the solder interconnect reliability of the gate-driver board in a mid-range variable frequency drive (VFD) was assessed. |
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| Keywords: | Power electronics High temperature Control boards High power Motor drives |
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