An investigation of the reliability of solderable ICA with low-melting-point alloy (LMPA) filler |
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| Affiliation: | 1. Lviv Polytechnic National University, 12 Bandera str., Lviv 79013, Ukraine;2. Lviv Institute of Materials of SRC “Carat”, 202 Stryjska str., Lviv 79031, Ukraine;3. Lviv State University of Life Safety, 35 Kleparivska str., Lviv 79007, Ukraine;4. Jan Dlugosz University, 13/15 Al. Armii Krajowej, Czestochowa 42201, Poland;5. Drohobych State Pedagogical University, 24 Ivan Franko str., Drohobych 82100, Ukraine;1. School of Information and Navigation, Air Force Engineering University, Xian 710077, China;2. Lanzhou Institute of Physics, Lanzhou 730000, China;1. Manufacturing Flagship, Commonwealth Scientific and Industrial Research Organisation, Ian Wark Laboratory, Bayview Avenue, Clayton, Victoria 3168, Australia;2. Monash Institute of Pharmaceutical Sciences, Parkville, Victoria 3052, Australia;3. Australian Regenerative Medicine Institute, Monash University, Clayton, Victoria 3168, Australia;1. Philips Research, High Tech Campus 34-6, 5656AE Eindhoven, The Netherlands;2. Department of Mechanical Engineering, Eindhoven University of Technology, PO Box 513, 5600MB Eindhoven, The Netherlands |
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| Abstract: | Conductive adhesives play a major role in the electronic packaging industry as an alternative to solder due to their potential advantages that include mild processing conditions and superior thermo-mechanical performance. In a conductive adhesive interconnection, adequate mechanical and electrical performance and long-term reliability are critical.In this paper, the reliability of solderable isotropic conductive adhesive (ICA) interconnections was investigated. Reliability testing was performed via thermal shock (?55 to 125 °C, 1000 cycles) and high-temperature and high-humidity tests (85 °C, 85% RH, 1000 h). The interfacial microstructure of the solderable ICA was also investigated. Additionally, the fracture mode was investigated via mechanical pull strength testing before and after the reliability test. The electrical resistance of the solderable ICA interconnection showed improved stability compared to conventional ICAs, and similar stability to conventional solder paste (Sn–3Ag–0.5Cu and Sn–58Bi) due to the metallurgical interconnection formed by the molten LMPA fillers between the corresponding metallization layers. After the reliability tests, the grown IMC layer was composed of Cu6Sn5 (η-phase) and Cu3Sn (ε-phase), and the scallop-type IMC transformed into a layer-type IMC. The fracture propagated along the Cu–Sn IMC/SnBi interface and the fracture surface showed a semi-brittle fracture mode mixed with cleavage and ductile tear bands. |
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| Keywords: | Intermetallic compounds Isotropic conductive adhesive Low melting point alloy Reduction capability Reliability Wettability |
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