A study on electrochemical effects in external capacitor packages |
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| Affiliation: | 1. SAGE-ENISo, National Engineering School of Sousse, 4023 University of Sousse, Tunisia;2. Al Leith Engineering College, Umm Al-Qura University, Saudi Arabia;3. ISIM, University of Gabes, 6072 Gabes, Tunisia;4. ESTACA Research Center, 92532 Levallois Perret, Paris, France;5. GPM-UMR CNRS 6634, University of Rouen, 76801 Saint Etienne du Rouvray, France;1. Departament d’Enginyeria Electrònica, Universitat Autònoma de Barcelona, Cerdanyola del Valles, Spain;2. Departamento de Electricidad y Electrónica, Universidad de Valladolid, Valladolid, Spain;3. Department of Chemistry, University of Helsinki, Helsinki, Finland;1. IMS-Bordeaux, Université de Bordeaux – UMR 5218, 351 cours de la Libération, 33405 Talence, France;2. Information Technology Laboratory, Gottfried Wilhelm Leibniz Universität Hannover, Hannover, Germany;1. Semiconductor Devices Division, Berlin University of Technology, Berlin, Einsteinufer 19, 10587 Berlin, Germany;2. French Space Agency (CNES), Toulouse, France;3. Hamamatsu Photonics Deutschland, Herrsching, Germany;1. STMicroelectronics, 850, rue Jean Monnet, 38926 Crolles Cedex, France;2. Laboratory of Computer Sciences, Paris 6 (LIP6), Systems On Chips Department, UPMC University, 4 place Jussieu, 75252 Paris Cedex 05, France;1. Le2i, UMR CNRS 6306, University of Burgundy, 9 Avenue Alain Savary, 21000 Dijon, France;2. Centre National d’Etudes Spatiales (CNES), 18 Avenue Edouard Belin, 31401 Toulouse, France |
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| Abstract: | Exposing semiconductor devices with external capacitors to harsh environmental conditions may lead to electrical failures with the formation of conductive paths. This paper presents examples of the analysis of modules with the purpose to understand the respective failure modes. Appropriate sample preparation, sensitive analytical methods like micro-X-ray fluorescence spectroscopy (μXRF), ToF-SIMS, SEM/EDX, X-ray-microscopy as well as micro computed X-ray-tomography (μCT) have been applied to identify the root causes of the electrical failures.As a main conclusion of these investigations, we found that electrolytes can easily penetrate thermoplastic overmold materials which are typically used by module manufacturers. This can lead to either reversible electrical failures which can be eliminated by drying or irreversible electrical failures because of material migration. The effective failure mode depends on mechanical and climate conditions inside the module which could not be simulated up to now under laboratory but only under application conditions. |
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| Keywords: | Electrochemical migration Failure analysis Water drop test Silver migration |
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