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Reliability enhancement by integrated liquid cooling in power IGBT modules for hybrid and electric vehicles
Affiliation:1. Dynex Semiconductor Ltd, Lincoln LN6 3LF, UK;2. Zhuzhou CSR Times Electric Co. Ltd, Zhuzhou, China;1. Department of Information Engineering, University of Padova, Via Gradenigo 6/B, 35131 Padova, Italy;2. E.T.C. S.r.l, Via Piero Gobetti, 101, 40129 Bologna, Italy;3. CNR-ISMN Bologna, Via Piero Gobetti, 101, 40129 Bologna, Italy;1. Airbus Group Innovations, Suresnes, France;2. Université de Lyon, Ampère, CNRS UMR 5005, INSA Lyon, Villeurbanne, France;3. Université de Technologie de Troyes, Institut Charles Delaunay, CNRS UMR 6279 STMR, Troyes, France;1. Department of Electric and Information Engineering (DIEI), University of Cassino and Southern Lazio, Via G. Di Biasio, 43, 03043 Cassino, FR, Italy;2. Fairchild Semiconductor GmbH, 85609 Aschheim/Munich, Germany;1. Fraunhofer Institute for Reliability and Microintegration [IZM], Gustav-Meyer-Allee 25, 13355 Berlin, Germany;2. Technical University Berlin, Microperipheric Center, Germany;1. Faculty of Engineering, University of Nottingham, NG7 2RD Nottingham, UK;2. Dynex Semiconductor Limited, Doddington Road, Lincoln LN6 3LF, UK
Abstract:Insulated Gate Bipolar Transistor (IGBT) modules in power train system of Hybrid and Electric Vehicles (HEV/EV) are working in harsh environment and high reliability and long lifetime are required. In this work, reliability enhancement by integrated liquid cooling structure in HEV/EV IGBT module is investigated. The thermal resistance of junction to heat sink can be reduced more than 50% by direct liquid cooling as eliminating thermal grease layer, so both active and passive temperature swings decrease significantly which will enhance module reliability and lifetime. The lifetime of modules with conventional and integrated liquid cooling structures are estimated under mission of standard driving cycles. We found that lifetime is prolonged obviously by direct cooling pin–fin base plate, and the compact module also makes the application power system simple and reliable.
Keywords:Hybrid and electric vehicles  IGBT module  Liquid cooling  Packaging  Reliability
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